Every year InnoElectro is an important meeting point for the electronics industry. This year again, many manufacturers and distributors presented their latest developments, from PCB manufacturing and testing to automation and robotics solutions.

Below is a brief summary of the main technological trends and types of tools that have been highlighted this year.

There are still two main solutions for automatic optical inspection (AOI) on the market: 2D and 3D systems. 3D AOI equipment is capable of providing a perspective view of the PCB under inspection, but many manufacturers stress that 2D mode remains important for detailed inspection of solder defects.

Several exhibitors presented automated soldering units that use a soldering iron head and solder wire dispenser moving on an X-Y-Z axis. These devices perform soldering one at a time, similar to manual soldering, but work at a steady and fast pace. They have the advantage of not requiring flux spray and allow for denser part layouts.

The conference section of the exhibition also featured a number of interesting presentations, including on the role of artificial intelligence in PCB and hardware design. It was concluded that AI can currently mainly make suggestions based on previous designs, but that their final adoption and integration remains an engineering responsibility.

The exhibition was also an opportunity for young engineers and university students to showcase their own developments. BME students, for example, presented their rocket project “Prometheus“, which has been successfully competing in international competitions.

InnoElectro 2025 has once again confirmed its role as one of the most important industrial meeting places in the region. The wide spectrum of technologies and solutions presented illustrated the evolution of the electronics industry, with a focus on automation, reliable quality control and new types of integrated systems.

If you’re interested in these trends or have questions about a specific technology solution, we’re happy to discuss our experience. Contact us at one of our contact details!

The embedded systems industry is evolving at an incredible pace, making it essential to stay ahead of the latest technological advancements. This year’s Embedded World, held in Nuremberg from March 11–13, once again proved to be a key event for the sector, attracting professionals from around the world.

With over 32,000 attendees from 80 countries, the event highlighted the strong international interest in embedded technology. Our development engineers at HC Linear Ltd. were on-site to explore the latest trends firsthand and exchange insights with industry experts.

We took the opportunity to visit several of our partners’ booths, learning about their newest products and developments while discussing key technical questions. The event also provided an excellent platform to forge new business relationships and potential collaborations.

This year’s exhibition featured cutting-edge innovations in WiFi 6 and Bluetooth 5.2 technology, with Panasonic Industry’s booth standing out for its demonstrations of Matter and PanMaX services alongside their WiFi 6 modules.

Two major conferences complemented the exhibition: the Embedded World Conference and the Electronic Displays Conference. With over 200 hours of expert-led sessions, these forums delved into the latest advancements shaping the industry. A key focus was the integration of AI and machine learning into embedded systems, unlocking new possibilities in real-time data processing and decision-making.

Cybersecurity was another hot topic, with companies showcasing advanced hardware and software security solutions designed to protect systems from cyber threats and ensure data integrity. Given the increasing emphasis on security from our customers, these developments are particularly relevant for us.

One of the event’s highlights was the Embedded Award 2025, recognizing groundbreaking innovations across nine categories. Some standout winners included:

• AI & Machine Learning: Ambiq‘s heartKIT™, an ultra-low-power AI-powered heart monitoring solution for battery-operated devices.
• Hardware: Cadence Design Systems’ Base System Chiplet, showcasing the advantages of chiplet-based architectures over traditional SoCs.
• Embedded Vision: Team Group Inc.’s D500R WORM SD / microSD cards, offering state-of-the-art data protection features.

Embedded World 2025 provided us with valuable insights into the future of embedded technology, reinforcing the importance of innovation, security, and efficiency. It was a fantastic opportunity to deepen professional connections and explore cutting-edge solutions that could shape the next generation of embedded systems.
Want to learn more about how these technologies can be applied in real-world scenarios?
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